JIACO Instruments MIP decapsulation system is a breakthrough innovation:

Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes.

2019 IASIC 中国国际半导体专项赛第一名

JIACO Instruments MIP decapsulation system is a breakthrough innovation:

Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes.

Market trends affecting decapsulation:

-Shift from Au to other bond wires and increasing complexity of packaging

-0 ppm drive within the industry

JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, high Tg, Chip on Board, BOAC; all without process induced damage for reliable failure analysis and reliability testing.

Dr. Tang received B.S. in materials science from Fudan University in 2007 and M.Sc. in materials science from University of Pennsylvania in 2009, where he was involved in research projects related to semiconductor devices.

From 2009 to 2014 he has been working towards his Ph.D. degree at Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology. His research activities focus on developing a Microwave Induced Plasma (MIP) instrument for copper wire bonded semiconductor package decapsulation application. During this period, intensive contacts were established with the semiconductor industry. The groundbreaking research jointly developed with industrial partners on the MIP technology has been presented at ECTC, ISTFA, EPTC, ICEPT conferences.

Since 2014, Jiaqi became the President and CTO of JIACO Instruments, the start-up company he co-founded to commercialize the MIP machine.